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Analogue Filter Hybrid Integrated Circuit

Technical Information

Catalogue No: C0276
Category: Surveillance/Acoustics
Object Type: Module/Sub-Assembly/Component
Object Name: Analogue Filter Hybrid Integrated Circuit
Part No: None
Serial No: None
Manufacturer: Unknown
Division: Unknown
Year of Manufacture: Unknown
Dimensions: Width (mm): 90
Height (mm): 12
Depth (mm): 64
Weight (g): 100
Location: Rack RAA03 [Main Store]

[on rear of hybrid IC case]
1920/1 M1 [or maybe: 1920/1 171]


A de-lidded 40-pin hybrid IC embedded in resin. The given dimensions are for the black plastic box containing the resin embedded hybrid IC; the embedded hybrid IC case alone (excluding pins) is: 55 x 4 x 29 mm.
The circuitry within the hybrid IC contains three quad op-amp IC chips surrounded by capacitor chips (including 2 tantalum electrolytics, coloured orange) and various forms of thick-film (printed) and thin-film (chip) resistors. This suggests the hybrid provided precision analogue filtering, possibly as part of sonar acoustic signal processing.
Nothing more is known at present about this particular Hybrid regarding its function or usage.

A hybrid integrated circuit, HIC, hybrid microcircuit, or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors and diodes) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB). If the components are on Printed Wiring Board (PWB) then, according to the definition of MIL-PRF-38534, it is not considered hybrid. A PCB can be called PWB if does not contain embedded components.

A hybrid circuit serves as a component on a PCB in the same way as a monolithic integrated circuit; the difference between the two types of devices is in how they are constructed and manufactured. Hybrid circuits for military and aerospace environments are usually in a metal case fitted with a hermetically sealed metal lid and glass insulated pins; ones for less demanding environments often have pins that are soldered to the edge of the substrate (usually ceramic) and protected by a polymer coating.

The advantage of hybrid circuits is that components which cannot be included in a monolithic IC can be used, e.g., capacitors of large value, wound components, crystals, inductors.Thick film technology is often used as the interconnecting medium for hybrid integrated circuits.

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